Heat Sink Compound - silicone, Type Z9, 1 oz

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Heat Sink Compound - silicone, Type Z9, 1 oz

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Type Z9, 1 fluid ounce. Silicone base, extra high-efficiency heat transfer. Made in USA. For mounting transistors, diodes, rectifiers, and resistors. Thermal joint compound for any device where efficient cooling is desired.

  • For effective transfer of heat between components & heat sinks
  • Will not dry or harden
  • White paste

Grease-like consistency; opaque white in color; zero bleed; very stable at elevated temperatures; excellent thermal resistance and high thermal conductivity; efficient thermal coupler; effective and positive heat sink sealers and heat transfer agent. The product offers high thermal conductivity, virtually no bleed or evaporation over a wide operating temperature range. It will not harden, dry out or melt after 1,000 hours at 200°C. Meets Mil-C-47009 and Mil-C-47113.

Please see attached Safety Data Sheet for more information.

Item ID:
Product Measurements
Bleed @ 200°C, 24 Hrs0.50 %/Wt
Dielectric Constant, 25°C @ 1,000 Hz4.90
Dielectric Strength, 0.05 in. Gap400 V/mil
Dissipation Factor, 25°C @ 1,000 Hz0.0011
Evaporation @ 200°C, 24 Hrs0.50 %/Wt
Flow Rate @ 50 Psi5 - 18 g per minute
Operating Temperature (TJ)-55°C to 205°C
Shelf Life5 years
Specific Gravity @ 25°C2.2
Thermal Conductivity @ 36°C0.70 W/m.-K
Volume1 oz.
Volume Resistivity1.96 × 1015 Ω×cm
Packaging Information
Packaging Dimensions9.5 in. × 2.8 in. × 1 in.
Weight (Packaging)0.182 lbs.

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