Heat Sink Compound - silicone, Type Z9, 1 oz
Type Z9, 1 fluid ounce. Silicone base, extra high-efficiency heat transfer. Made in USA. For mounting transistors, diodes, rectifiers, and resistors. Thermal joint compound for any device where efficient cooling is desired.
- For effective transfer of heat between components & heat sinks
- Will not dry or harden
- White paste
Grease-like consistency; opaque white in color; zero bleed; very stable at elevated temperatures; excellent thermal resistance and high thermal conductivity; efficient thermal coupler; effective and positive heat sink sealers and heat transfer agent. The product offers high thermal conductivity, virtually no bleed or evaporation over a wide operating temperature range. It will not harden, dry out or melt after 1,000 hours at 200°C. Meets Mil-C-47009 and Mil-C-47113.
Please see attached Safety Data Sheet for more information.
|Bleed @ 200°C, 24 Hrs||0.50 %/Wt|
|Dielectric Constant, 25°C @ 1,000 Hz||4.90|
|Dielectric Strength, 0.05 in. Gap||400 V/mil|
|Dissipation Factor, 25°C @ 1,000 Hz||0.0011|
|Evaporation @ 200°C, 24 Hrs||0.50 %/Wt|
|Flow Rate @ 50 Psi||5 - 18 g per minute|
|Operating Temperature (TJ)||-55°C to 205°C|
|Shelf Life||5 years|
|Specific Gravity @ 25°C||2.2|
|Thermal Conductivity @ 36°C||0.70 W/m.-K|
|Volume Resistivity||1.96 × 1015 Ω×cm|
|Packaging Dimensions||9.5 in. × 2.8 in. × 1 in.|
|Weight (Packaging)||0.182 lbs.|
|Specification Sheet||All Models|
|Safety Data Sheet||All Models|
I'll be using the heat sink compound when replacing CPU chips on several client computers. Trying to get a quantity of heat sink compound is not easy, since most of the computer parts stores only have the syringe type with very small amount of compound and a hi price at that! So, the Z9 is a bargain!