Heat Sink Compound - silicone, Type Z9, 1 oz
Type Z9, 1 fluid ounce. Silicone base, extra high-efficiency heat transfer. Made in USA. For mounting transistors, diodes, rectifiers, and resistors. Thermal joint compound for any device where efficient cooling is desired.
- For effective transfer of heat between components & heat sinks
- Will not dry or harden
- White paste
Grease-like consistency; opaque white in color; zero bleed; very stable at elevated temperatures; excellent thermal resistance and high thermal conductivity; efficient thermal coupler; effective and positive heat sink sealers and heat transfer agent. The product offers high thermal conductivity, virtually no bleed or evaporation over a wide operating temperature range. It will not harden, dry out or melt after 1,000 hours at 200°C. Meets Mil-C-47009 and Mil-C-47113.
Please see attached Safety Data Sheet for more information.
| Bleed @ 200°C, 24 Hrs | 0.50 %/Wt | |
| Consistency | 340 | |
| Dielectric Constant, 25°C @ 1,000 Hz | 4.90 | |
| Dielectric Strength, 0.05 in. Gap | 400 V/mil | |
| Dissipation Factor, 25°C @ 1,000 Hz | 0.0011 | |
| Evaporation @ 200°C, 24 Hrs | 0.50 %/Wt | |
| Flow Rate @ 50 Psi | 5 - 18 g per minute | |
| Operating Temperature (TJ) | -55°C to 205°C | |
| Shelf Life | 5 years | |
| Specific Gravity @ 25°C | 2.2 | |
| Thermal Conductivity @ 36°C | 0.70 W/m.-K | |
| Volume | 1 oz. | |
| Volume Resistivity | 1.96 × 1015 Ω×cm |
| Packaging Dimensions | 9.5 in. × 2.8 in. × 1 in. | |
| Weight (Packaging) | 0.182 lbs. |
 Specification Sheet | All Models |
| Safety Data Sheet | All Models |
My Project Lists
Questions and Answers
Staff Member
Product Reviews
I'll be using the heat sink compound when replacing CPU chips on several client computers. Trying to get a quantity of heat sink compound is not easy, since most of the computer parts stores only have the syringe type with very small amount of compound and a hi price at that! So, the Z9 is a bargain!